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About CoreTech System

CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995, and the current product “Moldex3D” is marketed worldwide.

ROI

CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment (ROI).

We care about real-world outcomes

Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service network to provide local, immediate, and professional service.

Moldex3D

Moldex3D is the world leading CAE product for the plastics injection molding industry. With the best-in-class analysis technology, Moldex3D can help you simulate the widest application range of injection molding processes to optimize product design and manufacturability, shorten time-to-market, and maximize product ROI.

modelx3d

IC Packaging

Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as :

  • Transfer Molding
  • Molded Underfill
  • Capillary Underfill (CUF)
  • Compression Molding
  • Embedded Wafer Level Package (EMWLP)
  • No Flow Underfill (NFU)
  • Non Conductive Paste (NCP)

Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.

3D CAD translator

Product Portfolio for Cloud Service & Moldex3D

We are creating a closed loop from design to manufacturing powering revolutions and fully supporting customers to break boundaries under the ever-changing industries.

process

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